Advanced Photonics, Vol. 2, Issue 6, 066004 (2020)
Metalens-integrated compact imaging devices for wide-field microscopy
Beibei Xu1,2,†, Hanmeng Li1,2,†, Shenglun Gao1,2, Xia Hua3, Cheng Yang3, Chen Chen1,2, Feng Yan3, Shining Zhu1,2, and Tao Li1,2,*
- 1Nanjing University, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Integration, Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing, China
- 2Collaborative Innovation Center of Advanced Microstructures, Nanjing, China
- 3Nanjing University, School of Electronic Science and Engineering, Nanjing, China
Metasurfaces have demonstrated unprecedented capabilities in manipulating light with ultrathin and flat architectures. Although great progress has been made in the metasurface designs and function demonstrations, most metalenses still only work as a substitution of conventional lenses in optical settings, whose integration advantage is rarely manifested. We propose a highly integrated imaging device with silicon metalenses directly mounted on a complementary metal oxide semiconductor image sensor, whose working distance is in hundreds of micrometers. The imaging performances including resolution, signal-to-noise ratio, and field of view (FOV) are investigated. Moreover, we develop a metalens array with polarization-multiplexed dual-phase design for a wide-field microscopic imaging. This approach remarkably expands the FOV without reducing the resolution, which promises a non-limited space-bandwidth product imaging for wide-field microscopy. As a result, we demonstrate a centimeter-scale prototype for microscopic imaging, showing uniqueness of meta-design for compact integration.
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