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  • Received: Jun. 23, 2008

    Accepted: --

    Posted: Mar. 20, 2009

    Published Online: Mar. 20, 2009

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    Zhigang Liu, Gaozhan Fang, Kecheng Feng. High packing density laser diode stack arrays using Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks[J]. Chinese Optics Letters, 2009, 7(3): 214

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Chinese Optics Letters, Vol. 7, Issue 3, 214 (2009)

High packing density laser diode stack arrays using Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks

Zhigang Liu, Gaozhan Fang, and Kecheng Feng

Author Affiliations

  • School of Science, Changchun University of Science and Technology, Changchun 130022

Abstract

A high packing density laser diode stack array is developed utilizing Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks. The microchannel cooling technology leads to a 10-bar laser diode stack array having the thermal resistance of 0.199 oC/W, and enables the device to be operated under continuous-wave (CW) condition at an output power of 1200 W. The thickness of the discrete copper heatsink is only 1.5 mm, which results in a high packing density and a small bar pitch of 1.8 mm.

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