Chinese Optics Letters, Vol. 2, Issue 9, 09541 (2004)
Avoiding silicon/glass bonding damage with fusion bonding method
Daohong Yang1,2,*, Chen Xu1,2, and Guangdi Shen1,2
- 1College of Electronic Information &
- 2Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022
A novel fusion bonding method between silicon and glass with Nd:YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 μm, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.
Please Enter Your Email: