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  • Received: Mar. 15, 2004

    Accepted: --

    Posted: Jun. 6, 2006

    Published Online: Jun. 6, 2006

    The Author Email: Daohong Yang (daohongyang@emails.bjpu.edu.cn)

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    Daohong Yang, Chen Xu, Guangdi Shen. Avoiding silicon/glass bonding damage with fusion bonding method[J]. Chinese Optics Letters, 2004, 2(9): 09541

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Chinese Optics Letters, Vol. 2, Issue 9, 09541 (2004)

Avoiding silicon/glass bonding damage with fusion bonding method

Daohong Yang1,2,*, Chen Xu1,2, and Guangdi Shen1,2

Author Affiliations

  • 1College of Electronic Information &
  • 2Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022

Abstract

A novel fusion bonding method between silicon and glass with Nd:YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 μm, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.

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