Main > Chinese Optics Letters >  Volume 17 >  Issue 4 >  Page 041301 > Article
  • Abstract
  • Abstract
  • Figures (11)
  • Tables (0)
  • Equations (3)
  • References (16)
  • Suppl. Mat.
  • Cited By (0/0)
  • Get PDF
  • View Full Text
  • Paper Information
  • Received: Nov. 1, 2018

    Accepted: Jan. 15, 2019

    Posted: Apr. 15, 2019

    Published Online: Apr. 15, 2019

    The Author Email: Kai Liu (kliu@bupt.edu.cn)

    DOI: 10.3788/COL201917.041301

  • Get Citation
  • Copy Citation Text

    Kai Liu, Qi Wei, Yongqing Huang, Xiaofeng Duan, Qi Wang, Xiaomin Ren, Shiwei Cai. Integrated optoelectronic chip pair for transmitting and receiving optical signals simultaneously[J]. Chinese Optics Letters, 2019, 17(4): 041301

    Download Citation

  • Category
  • Integrated optics
  • Share
Chinese Optics Letters, Vol. 17, Issue 4, 041301 (2019)

Integrated optoelectronic chip pair for transmitting and receiving optical signals simultaneously

Kai Liu*, Qi Wei, Yongqing Huang, Xiaofeng Duan, Qi Wang, Xiaomin Ren, and Shiwei Cai

Author Affiliations

  • State Key Laboratory of Information Photonics and Optical Communications, Beijing University of Posts and Telecommunications, Beijing 100876, China

Abstract

An integrated optoelectronic chip pair, which can transmit and receive optical signals simultaneously, is proposed in this Letter. The design and optimization of its key structure, the vertical cavity surface emitting laser’s distributed Bragg reflector, are presented. Analysis is also done for its influence on the integrated chip’s performance. Moreover, the chip pair’s performance under dynamic conditions is analyzed. Their 3 dB modulation bandwidths are higher than 10 GHz, and their 3 dB photo-response bandwidths are around 23 GHz. Their applications will further improve the performances of the optical interconnects.